Enhancing Inspection of PCB Attachment to Power Inverter
OMRON's innovative inspection technology recognizes the power module is a critical part of EV subassembly and allows for accuracy as well as speed when measuring each solder area during PCB attachment. Our solution improves inspection results while simultaneously optimizing product quality.
For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.
Automated inspection technology developed by OMRON specifically for this task helps to improve results and bolster product quality. OMRON's VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.
Fast x-ray inspection
Inspect several layers of solder paste condition and thickness by Full 3D CT inspection.
VT-X750 3D CT X-RAY
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-definition, high-quality inspection using full 3D-CT.