Application: Automated Chip Inspection in the back-end

With the rapid evolution of chip packaging, the structure of semiconductor devices is becoming increasingly complex. The need to ensure the quality and reliability of chip-to-substrate interconnects and prevent defects has led to a rapid increase in the level of inspection required to improve yields.

Our solution: Automated Inspection System

We provide inspection solutions for 3D packaging for the semiconductor industry. We can automatically and quantitatively inspect all sizes of bumps inside semiconductor chips without the need for non-destructive testing or defect cutting. Leveraging the X-ray inspection technology we cultivated in the SMT industry, we are reforming the inspection process in the semiconductor industry and contributing to a significant increase in mass production. In addition, we provide solutions to solve our customer issues not only in the mass production phase, but also in the R&D and initial production phases.

Our inspection solutions have strengths such as high-speed CT imaging, automatic inspection, quality data accumulation, real-time monitoring, and rapid pre- and post-process condition feedback. It enables inspection of all parts with defect tendencies, continuous monitoring to ensure production requirements are met, and detection of abnormalities and early collection.