Inspection of bonding conditions
Inspection of bonding conditions
Challenge
After die/wire bonding, the condition of the wiring or solder on the lead frame can be inspected. Die or lead frame variations require the inspection system to be flexible and easy to set up.
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Solution
With real color sensing, subtle variations in color can be accurately recognized even when there is little contrast. The high-precision camera provides both high resolution at 2 million pixels and high-speed image capture of 30 fps.
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Benefit
Strict quality management with high throughput, as well as savings in setting-up time for changeovers.
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